Compact LES with high light density
Latest advanced phosphor technology, high color consistency
Thermal-electric isolation copper substrate, safe & stable
Intersecting distribution of 5 colors, optimized color-mixing
Application Area
Entertainment lighting
Architectural lighting
Medical illumination, Fiber Optics
Event lighting
Stage lighting Projection
Small LES only 16.3mm Eutectic flip-chip bonding technique Higher Forward Voltage, Lower Forward Current, Excellent effect of color-mixing for 6 Colors LEDs light source Copper MCPCB, high thermal conductivity
